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ds04-27212-4e fujitsu semiconductor data sheet copyright?1994-2006 fujitsu limited all rights reserved assp for power supply applications bipolar switching regulator controller (low voltage) mb3800 description the mb3800 is a single-channel switching regulator contro l ic for low voltage applications incorporating a soft start function and short circuit detection function. the device has a low minimum operating voltage of 1.8 v and is ideal for the power supply of battery-operated electronic equipment. features ? wide supply voltage operating range: 1.8 v to 15 v low current consumption: typically 5.5 ma in operation, 1 a or less in stand-by high speed operation is possible: maximum 1 mhz the error amplifier gain is set inside the ic , so peripheral components are minimized. incorporates a soft start circuit. incorporates a timer-latch type short circuit detection circuit (scp). totem-pole type output with adjustable on/off current (for npn transistors) incorporates a stand-by function. three types of packages (sop-8 : 2 types, ssop-8 : 1 type) application lcd monitor/panel power supply module portable apparatus etc.
mb3800 2 pin assignment pin description pin no. symbol i/o description 1 ?in i error amplifier inverting input pin 2 scp ? soft start and scp setting capacitor connection pin 3v cc ? power supply pin 4 br/ctl i output current setting and control pin 5 out o totem-pole type output pin 6 gnd ? ground pin 7 osc ? capacitor and resistor connection pi n for setting the oscillation frequency 8 fb o error amplifier output pin 2 1 4 3 ?in scp v cc br/ctl osc fb out gnd 8 7 6 5 (top view) (fpt-8p-m01) (fpt-8p-m02) (fpt-8p-m03)
mb3800 3 block diagram 3 7 6 2 4 5 1 8 0.6 v? 0.1 v? 0.1 v 36 k ? 0.5 v pwm comp. out ? + + 1.25 v error amp 500 ? ? + ?in fb gnd scp br/ctl dtc 0.6 v 0.3 v 30 k ? v cc osc + output drive control circuit soft start scp sawtooth wave oscillator reference voltage supply
mb3800 4 absolute maximum ratings *: when mounted on a 10 cm square double-sided epoxy board. warning: semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. do not exceed these ratings. recommended operating conditions (ta = +25 c) warning: the recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. all of the device?s electric al characteristics are warranted when the device is operated within these ranges. always use semiconductor devices within their recommended operating cond ition ranges. operation outside these ranges may adversely affect re liability and could result in device failure. no warranty is made with respect to uses, operat ing conditions, or combinations not represented on the data sheet. users considering application outside the listed conditions are advised to contact their fujitsu representatives beforehand. parameter symbol condition rating unit min max power supply voltage v cc ? ?16v output source current i o + ??50ma output sink current i o ? ?50ma allowable dissipation p d fpt-8p-m01, ta +25 c ? 570* mw fpt-8p-m02, ta +25 c ? 430* mw ssop-8, ta +25 c ? 580* mw storage temperature t stg ??55+125 c parameter symbol value unit min typ max power supply voltage v cc 1.8 ? 15 v error amplifier input voltage v i ?0.2 ? +1.0 v br/ctl pin input voltage v br ?0.2 ? v cc v output source current i o + ?40 ? ? ma output sink current i o ? ??40ma scp pin capacitance c pe ?0.1? f phase compensation capacitance c p ?0.1? f output current setting resistance r b 150 390 5000 ? timing resistance r t 1.0 3.0 10.0 k ? timing capacitance c t 100 270 10000 pf oscillation frequency f osc 10 500 1000 khz operating ambient temperature ta ?30 +25 +85 c
mb3800 5 electrical characteristics (v cc = +2 v, ta = +25 c) (continued) parameter symbol condition value unit min typ max circuit to prevent malfunction at low input voltage (u.v.l.o.) reset voltage v r ? ??0.9v threshold voltage v th 1.1 1.3 1.5 v soft start charging current i cs v scp = 0 v ?1.5 ?1.0 ?0.7 a voltage at soft start completion v ts ?0.70.80.9v short circuit detection (s.c.p.) charging current i cpc v scp = 0 v ?1.5 ?1.0 ?0.7 a threshold voltage v tpc ?0.70.80.9v sawtooth wave oscillator (osc) oscillation frequency f ocs r t = 3.0 k ? , c t = 270 pf 400 500 600 khz frequency input stability f dv v cc = 2 v to 15 v ? 2 10 % frequency variation with temperature f dt ta = ?30c to +85c ? 5 ? % error amplifier input threshold voltage v t v fb = 450 mv 480 500 520 mv v t input stability v tdv v cc = 2 v to 15 v ? 5 20 mv v t variation with temperature v tdt ta = ?30c to +85c ? 1 ? % input bias current i b v in = 0 v ?1.0 ?0.2 +1.0 a voltage gain a v ? 70 100 145 v/v frequency bandwidth bw a v = 0 db ? 6 ? mhz maximum output voltage range v om + ? 0.78 0.87 ? v v om ? ? 0.05 0.2 v output source current i om + v fb = 0.45 v ? ?40 ?24 a output sink current i om ? 24 40 ? a idle period adjustment section maximum duty cycle t duty r t = 3.0 k ? , c t = 270 pf v fb = 0.8 v 65 75 85 %
mb3800 6 (continued) diagram parameter symbol condition value unit min typ max output section output voltage v oh1 r b = 390 ? , i o = ?15 ma 1.0 1.2 ? v v oh2 r b = 750 ? , v cc = 1.8 v i o = ?10 ma 0.8 1.0 ? v v ol1 r b = 390 ? , i o = 15 ma ? 0.1 0.2 v v ol2 r b = 750 ? , v cc = 1.8 v i o = 10 ma ?0.10.2 v output source current i o + r b = 390 ? , v o = 0.9 v ? ?30 ?20 ma output sink current i o ? r b = 390 ? , v o = 0.3 v 30 60 ? ma pull down resistance r o ? 203040k ? output current setting section/ control section pin voltage v br r b = 390 ? 0.2 0.3 0.4 v input off condition i off ? ?20 ? 0 a input on condition i on ???45 a pin current range i br ?1.8 ? ?0.1 ma entire device stand-by current i ccs br/ctl pin open or v cc ?? 1 a average supply current i cc r b = 390 ? ?5.59.3ma t s t pe on off fb pin voltage reference input for short circuit detection comparator idle period setting voltage sawtooth wave output soft start setting voltage out pin waveforms scp pin waveforms power supply control sw soft start output short circuit output short circuit short circuit detection
mb3800 7 how to set the time constant for soft start and short circuit detection 1. soft start at power on, the capacitor c pe connected to the scp pin (pin 2) starts charging. the pwm comparator compares the soft start setting voltage as a proportion of the voltage at the scp pin with the sawtooth waveform. the comparison controls the on duty of the out pin (pin 5), causing the soft st art operation. on completion of soft start operation, the voltage at the scp pin stays low, the soft start setting voltage stays high, and the circuit enters the output short circuit detection wait state. soft start time (the time until the output on duty reaches approximately 50%) t s [s] ? 0.35 c pe [ f] 2. short circuit protection if the switching regulator output suddenly drops due to load effect, the error amplif ier output (fb pin (pin 8)) is fixed at vom + and capacitor c pe starts charging. when the voltage at the scp pin reaches approximately 0.8 v, the out pin (pin 5) is set low and the scp pin (pin 2) stays low. once the protection circuit operates, the circui t can be restored by resetting the power supply. short circuit detection time t pe [s] ? 0.8 c pe [ f]
mb3800 8 typical characteristics (continued) 10 8 6 4 2 0 4 8 12 16 20 supply voltage v cc (v) average supply current i cc (ma) 1.0 0.8 0.6 0.4 0.2 0 4 8 12 16 20 supply voltage v cc (v) input threshold voltage v t (v) input threshold voltage vs. supply voltage t a = +25 c 10 5 0 ?10 +80 +100 operating ambient temperature t a ( c) input threshold voltage variation ratio ? v t /v t (%) input threshold voltage variation ratio vs. operating ambient temperature v cc = 2 v 1.0 0.8 0.6 0.4 0.2 0 0 2.0 3.0 4.0 5.0 supply voltage v cc (v) input threshold voltage v t (v) input threshold voltage vs. supply voltage t a = +25 c +40 +60 0 +20 ?40 ?20 ?5 2.0 1.6 1.2 0.8 0.4 ?10 ?20 ?30 ?40 ?50 high level output current i out (ma) high level output voltage v out (v) high level output v cc = 2 v r b = 390 ? t a = +25 c 500 400 300 200 100 20 40 60 80 100 low level output current i out (ma) low level output voltage v out (mv) low level output v cc = 2 v r b = 390 ? t a = +25 c 00 00 t a = +25 c r b = 390 ? 00 1.0 ?15 average supply current vs. supply voltage
mb3800 9 (continued) -10 -0.4 br/ctl pin input current i br (ma) output source current i out (ma) output source current vs. br/ctl pin input current 0 0 -0.8 -1.2 -1.6 -2.0 -20 -30 -40 -50 v cc = 2 v v out = 0.9 v t a = +25 c 100 -0.4 br/ctl pin input current i br (ma) br/ctl pin input voltage v br (mv) br/ctl pin input voltage vs. br/ctl pin input current 0 0 -0.8 -1.2 -1.6 -2.0 200 300 400 500 v cc = 2 v t a = +25 c 1.0 -20 br/ctl pin input current i br ( a) average supply current i cc (ma) average supply current vs. br/ctl pin input current 0 0 -40 -60 -80 -100 2.0 3.0 4.0 5.0 v cc = 2 v t a = +25 c 1 k timing resistor r t ( ? ) oscillation frequency f osc (hz) oscillation frequency vs.timing resistor 10 k 2 k 50 k 500 k 2 supply voltage v cc (v) frequency variation ratio ? f/f (%) frequency variation ratio vs. supply voltage -15 0 5 10 -5 0 -10 4 6 8 10 12 14 16 c t = 270 pf r t = 3.0 k ? t a = +25 c -20 operating ambient temperature t a ( c) frequency variation ratio ? f/f (%) frequency variation ratio vs. operating ambient temperature -15 -40 5 10 -5 0 -10 0 +20 +40 +60 +80 +100 v cc = 2 v c t = 270 pf r t = 3.0 k ? 5 k 20 k 200 k 5 k 2 k 10 k 100 k 1 m 20 k c t = 100 pf c t = 1000 pf c t = 10000 pf v cc = 2 v t a = +25 c
mb3800 10 (continued) oscillation frequency f osc (hz) maximum duty cycle t duty (%) maximum duty cycle vs. oscillation frequency 0 10 k 100 40 60 20 100 k 1 m 80 0 0.4 0.8 1.2 1.6 2.0 t( s) ?50 0 50 0 2 4 6 (v) (ma) v out i out 2 v 10 mv 200 ns v cc = 2 v c t = 270 pf r t = 1.0 k ? 18 k ? 2 k ? 10 f + i out (5 v) 390 ? v out 22 h v cc mb3800 5 4 ?in output pin voltage and current waveforms (reference data) note: the off delay time of v out depends on the characteristics of the external transistor. measurement circuit diagram v cc = 2 v c t = 270 pf t a = +25 c
mb3800 11 functional description 1. switching regulator function (1) reference voltage circuit the reference voltage circuit generates a temperature-compensated reference voltage ( ? 1.25v) from voltage supplied from the v cc pin (pin 3). in addition to providing the reference voltage for the switching regulator, the circuit also sets the idle period. (2) sawtooth wave oscillator the sawtooth oscillator generates a sawtooth wave (up to 1 mhz) that is stable with respect to the supply voltage and temperature. the capacitor and resistor that set the os cillation frequency are connec ted to the osc pin (pin 7). (3) error amplifier (error amp) the error amplifier detects the output voltage of the sw itching regulator and outputs the pwm control signal. the voltage gain is fixed, and connecting a phase compensation capacitor to the fb pin (pin 8) provides stable phase compensation for the system. (4) pwm comparator (pwm comp.) the voltage comparator has one inverting and three non-in verting inputs. the comparator is a voltage/pulse width converter that controls the on time of the output pulse depending on the input voltage. the output level is high (h) when the sawtooth wave is lower than the error amplifier output voltage, soft start setting voltage, and idle period setting voltage. (5) output circuit the output circuit has a totem pole type configuration and can drive an exter nal npn transistor directly. the value of the on/off current can be set by a resi stor connected to the br/ctl pin (pin 4). 2. power supply control function stand-by mode (supply current 1 a or less) can be set by connecting the br/ctl pin (pin 4) to v cc or by making the pin open circuit. sw mode off stand-by mode on operating mode rb sw 4 br/ct l mb3800
mb3800 12 3. other functions (1) soft start and short circuit detection soft start operation is set by connecting capacitor c pe to the scp pin (pin 2). soft start prevents a current spike on start-up. on completion of soft start operation, the scp pin (pin 2) stays low and enters the short circuit detection wait state. when an output short circuit occurs, the error amplifier output is fixed at v om + and capacitor c pe starts charging. after charging to approximately 0.8 v, the out pin (pin 5) is set low and the scp pin (pin 2) stays low. once the protection circuit operates, the circuit can be restored by resetting the power supply. (see ? how to set the time constant for soft st art and short circuit detection?.) (2) circuit to prevent malfunction at low input voltage transients when powering on or instantaneous glitches in th e supply voltage can lead to malfunction of the control ic and cause system damage or failure. the circuit to prevent malfunction at low input voltage detects a low input voltage by comparing the supply voltage to the internal reference voltage. on detection, the circuit fixes the out pin (pin 5) to low. the system recovers when the supply voltage rises back above the threshold voltage of the malfunction prevention circuit. application example 1 2 4 3 8 7 6 5 mb3800 3 k ? 22 h 10 f 270 pf 0.1 f 18 k ? v o (5 v) 2 k ? 0.1 f 390 ? ctl 33 f + + v in (3 v) fb osc gnd out ein scp v cc br/ctl
mb3800 13 notes on use take account of common impedance when designing the earth line on a printed wiring board. take measures against static electricity. - for semiconductors, use antista tic or conductive containers. - when storing or carrying a printed circuit board after ch ip mounting, put it in a co nductive bag or container. - the work table, tools and meas uring instruments must be grounded. - the worker must put on a gro unding device containing 250 k ? to 1 m ? resistors in series. do not apply a negative voltage - applying a negative voltage of ? 0.3 v or less to an lsi may generate a parasitic transistor, resulting in malfunction. ordering information rohs compliance information of lead (pb) free version the lsi products of fujitsu with ?e1? are compliant with rohs directive , and has observed the standard of lead, cadmium, mercury, hexavalent chromium, polyb rominated biphenyls (pbb) , and polybrominated diphenyl ethers (pbde) . the product that conforms to this standard is added ?e1? at the end of the part number. part number package remarks mb3800pf- ??? 8-pin plastic sop (fpt-8p-m01) conventional version mb3800pnf- ??? 8-pin plastic sop (fpt-8p-m02) conventional version mb3800pfv- ??? 8-pin plastic ssop (fpt-8p-m03) conventional version mb3800pf- ??? e1 8-pin plastic sop (fpt-8p-m01) lead free version mb3800pnf- ??? e1 8-pin plastic sop (fpt-8p-m02) lead free version mb3800pfv- ??? e1 8-pin plastic ssop (fpt-8p-m03) lead free version
mb3800 14 marking format (lead free version) index 3800 e1xxxx xxx lead free version 3800 xxxx e1 xxx lead free version index 3800 1 xxx xxx lead free version ssop-8 (fpt-8p-m03) sop-8 (fpt-8p-m01) sop-8 (fpt-8p-m02)
mb3800 15 labeling sample (lead free version) 2006/03/01 assembled in japan g qc pass (3n) 1mb123456p-789-ge1 1000 (3n)2 1561190005 107210 1,000 pcs 0605 - z01a 1000 1/1 1561190005 mb123456p - 789 - ge1 mb123456p - 789 - ge1 mb123456p - 789 - ge1 pb lead free version lead-free mark jeita logo jedec logo
mb3800 16 mb3800pf- ??? e1, mb3800pnf- ??? e1, mb3800pfv- ??? e1 recommended conditions of moisture sensitivity level [temperature profile for fj standard ir reflow] (1) ir (infrared reflow) (2) manual soldering (partial heating method) conditions : temperature 400 c max times : 5 s max/pin item condition mounting method ir (infrared reflow) , m anual soldering (partial heating method) mounting times 2 times storage period before opening please use it within two years after manufacture. from opening to the 2nd reflow less than 8 days when the storage period after opening was exceeded please processes within 8 days after baking (125 c, 24h) storage conditions 5 c to 30 c, 70 % rh or less (the lowest possible humidity) 260 c (e) (d') (d) 255 c 170 c 190 c rt (b) (a) (c) to note : temperature : the top of the package body (a) temperature increase gradient : average 1 c/s to 4 c/s (b) preliminary heating : temperature 170 c to 190 c, 60s to 180s (c) temperature increase gradient : average 1 c/s to 4 c/s (d) actual heating : temperature 260 c max; 255 c or more, 10s or less (d?) : temperature 230 c or more, 40s or less or temperature 225 c or more, 60s or less or temperature 220 c or more, 80s or less (e) cooling : natural cooling or forced cooling h rank : 260 c max
mb3800 17 package dimensions (continued) 8 -pin pl as tic s op le a d pitch 1.27 mm p a ck a ge width p a ck a ge length 5. 3 6. 3 5 mm le a d s h a pe g u llwing s e a ling method pl as tic mold mo u nting height 2.25 mm max weight 0.10 g code (reference) p- s op 8 -5. 3 6. 3 5-1.27 8 -pin pl as tic s op (fpt- 8 p-m01) (fpt- 8 p-m01) c 2002 fujit s u limited f0 8 002 s -c-6-7 0.1 3 (.005) m det a il s of "a" p a rt 7. 8 00.40 5. 3 00. 3 0 (.209.012) (. 3 07.016) .250 ?.00 8 +.010 ?0.20 +0.25 6. 3 5 index 1.27(.050) 0.10(.004) 14 5 8 0.470.0 8 (.019.00 3 ) ?0.04 +0.0 3 0.17 .007 +.001 ?.002 "a" 0.25(.010) ( s t a nd off) 0~ 8 ? (mo u nting height) 2.00 +0.25 ?0.15 .079 +.010 ?.006 0.500.20 (.020.00 8 ) 0.600.15 (.024.006) 0.10 +0.10 ?0.05 ?.002 +.004 .004 * 1 0.10(.004) * 2 dimen s ion s in mm (inche s ). note: the v a l u e s in p a renthe s e s a re reference v a l u e s . note 1) * 1 : the s e dimen s ion s incl u de re s in protr us ion. note 2) * 2 : the s e dimen s ion s do not incl u de re s in protr us ion. note 3 )pin s width a nd pin s thickne ss incl u de pl a ting thickne ss . note 4) pin s width do not incl u de tie ba r c u tting rem a inder.
mb3800 18 (continued) 8 -pin pl as tic s op le a d pitch 1.27 mm p a ck a ge width p a ck a ge length 3 .9 5.05 mm le a d s h a pe g u llwing s e a ling method pl as tic mold mo u nting height 1.75 mm max weight 0.06 g 8 -pin pl as tic s op (fpt- 8 p-m02) (fpt- 8 p-m02) c 2002 fujit s u limited f0 8 004 s -c-4-7 1.27(.050) 3 .900. 3 0 6.000.40 .199 ?.00 8 +.010 ?0.20 +0.25 5.05 0.1 3 (.005) m (.154.012) (.2 3 6.016) 0.10(.004) 14 5 8 0.440.0 8 (.017.00 3 ) ?0.07 +0.0 3 0.22 .009 +.001 ?.00 3 45 ? 0.40(.016) "a" 0~ 8 ? 0.25(.010) (mo u nting height) det a il s of "a" p a rt 1.550.20 (.061.00 8 ) 0.500.20 (.020.00 8 ) 0.600.15 (.024.006) 0.150.10 (.006.004) ( s t a nd off) 0.10(.004) * 1 * 2 dimen s ion s in mm (inche s ). note: the v a l u e s in p a renthe s e s a re reference v a l u e s . note 1) * 1 : the s e dimen s ion s incl u de re s in protr us ion. note 2) * 2 : the s e dimen s ion s do not incl u de re s in protr us ion. note 3 )pin s width a nd pin s thickne ss incl u de pl a ting thickne ss . note 4) pin s width do not incl u de tie ba r c u tting rem a inder.
mb3800 19 (continued) 8 -pin pl as tic ss op le a d pitch 0. 8 0 mm p a ck a ge width p a ck a ge length 4.2 3 .5 mm le a d s h a pe g u llwing s e a ling method pl as tic mold mo u nting height 1.45 mm max weight 0.04 g code (reference) p- ss op 8 -4.2 3 .5-0. 8 0 8 -pin pl as tic ss op (fpt- 8 p-m0 3 ) (fpt- 8 p-m0 3 ) c 2002 fujit s u limited f0 8 005 s -c- 3 -5 3 .500.10(.1 38 .004) 4.200.10 6.200.20 (.244.00 8 ) (.165.004) 0.10(.004) m .049 ?.004 +.00 8 ?0.10 +0.20 1.25 index * 1 0. 8 0(.0 3 1) 0.10(.004) 0~ 8 ? 0.25(.010) (mo u nting height) 14 5 8 0. 3 70.0 8 (.015.00 3 ) ?0.04 +0.0 3 0.17 .007 +.001 ?.002 "a" 0.500.20 (.020.00 8 ) 0.600.15 (.024.006) 0.100.10 ( s t a nd off) (.004.004) det a il s of "a" p a rt 0.10(.004) * 2 dimen s ion s in mm (inche s ). note: the v a l u e s in p a renthe s e s a re reference v a l u e s . note 1) * 1 : re s in protr us ion. (e a ch s ide : +0.15 (.006) m a x). note 2) * 2 : the s e dimen s ion s do not incl u de re s in protr us ion. note 3 )pin s width a nd pin s thickne ss incl u de pl a ting thickne ss . note 4) pin s width do not incl u de tie ba r c u tting rem a inder.
mb3800 f0605 fujitsu limited all rights reserved. the contents of this document are subject to change without notice. customers are advised to consult with fujitsu sales representatives before ordering. the information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of fujitsu semiconductor device; fujitsu does not warrant proper operation of the device with respect to use based on such information. when you develop equipment incorporating the device based on such information, you must assume any responsibility arising out of such use of the information. fujitsu assumes no liability for any damages whatsoever arising out of the use of the information. any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any ot her right of fujitsu or any third party or does fujitsu warrant non-in fringement of any third-party?s intellectual property right or othe r right by using such information. fujitsu assumes no liability for any infringement of the intellectual property rights or other rights of third parties which would result from the use of information contained herein. the products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless extremel y high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, ai rcraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon syst em), or (2) for use requiring extremely high reliability (i.e., su bmersible repeater and artificial satellite). please note that fujitsu will not be liable against you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. any semiconductor devices have an inherent chance of failure. you must protect against injury, damage or loss from such failures by incorporating safety design m easures into your facility and equipment such as redundancy, fi re protection, and prevention of over-current levels and other abnormal operating conditions. if any products described in this document represent goods or technologies subject to certain restrictions on export under the foreign exchange and foreign trade law of japan, the prior authorization by japanese government will be required for export of those products from japan. edited business promotion dept.

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